Worldwide manufacturing

Building the next era of semiconductor manufacturing

Delivering geopolitically dependable supply

We have a long history of globally owned, regionally diverse internal manufacturing operations, including wafer fabs, assembly and test factories, and bump and probe facilities across 15 worldwide sites. We manufacture tens of billions of analog and embedded processing semiconductors annually, across more than 80,000 different products, and deliver them to more than 100,000 customers around the globe. Our investment in internal manufacturing capacity provides greater assurance of supply to better support our customers.

Investing in manufacturing to support growth for decades to come

We’re making strategic investments to grow 300-mm wafer fab manufacturing, which provide advantages in efficiency and quality, and targeted investments in existing 200-mm capacity. Our assembly and test sites – which separate individual semiconductor products from the wafer and assemble, package and test them – are undergoing continuous expansion, modernization and automation to meet customer demand. These new investments support plans to grow our internal wafer manufacturing and internal assembly and test operations to more than 90% by 2030.

300-mm wafer fab manufacturing

Sherman, Texas (SM1, SM2, SM3, SM4)

Announced in November 2021, the site has the potential for four fabs operating as one site to meet demand over time. Construction is underway, and production from the first fab is expected in 2025.

Read about Sherman

Lehi, Utah (LFAB1, LFAB2)

LFAB was purchased in 2021 and began 300-mm wafer production in 2022. Announced in February 2023, a second 300-mm semiconductor wafer fab will be built on the site and connected to the existing fab.

Read about Lehi

Richardson, Texas (RFAB1, RFAB2)

RFAB opened in 2009 as the world’s first 300-mm analog wafer fab. A second 300-mm wafer fab connected to the first fab started production in 2022.

Read about Richardson


Dallas, Texas (DMOS6)

DMOS6 ramped for 300-mm analog technologies in 2014, and is one of our first 300-mm wafer fab operations.



A core element of our strategy is to invest in increasing our internal manufacturing capacity – in wafer fabs and assembly-test sites we own – rather than relying only on external suppliers. We are growing our internal capacity to support the increasing need for semiconductors, and we and our customers remain pleased with the progress of our expansions.
– Kyle Flessner | Texas Instruments senior vice president, Technology and Manufacturing Group

Our internal manufacturing advantages

Our goal is to deliver products to our customers where and when they’re needed. Our flexible manufacturing strategy and control of our supply chain provide greater assurance of supply to meet current and future demands, with robust business continuity processes to support unpredictable markets. We have the ability to source more than 85% of products from multiple sites to speed up delivery time for our customers.

We’re investing and increasing capacity in 45 to 130-nm technology nodes, which provide the optimal cost, performance, power, precision and voltage levels required for our broad portfolio of analog and embedded products. Our investments in these technologies recognize the criticality and long-term need for these nodes, and allow us to provide customers with products that will be needed for decades to come.

We have a long-standing commitment to responsible, sustainable manufacturing, including:

  • Reducing energy and greenhouse gas emissions through upgraded factory tools, abatement technology and using more alternative energy
  • Reusing or recycling nearly 90% of our waste and surplus materials
  • Reusing much of our water, saving millions of gallons each year
  • Designing our new facilities to meet LEED Gold standards for structural efficiency and sustainability