Part ratings
Texas Instruments (TI) understands that semiconductor quality and reliability standards are important. With that in mind, our part ratings can help you more easily find parts that align with industry standards.
Rating description
Rating | Description and target applications |
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Catalog | TI classifies a majority of its parts as catalog products, which it releases in alignment with its own quality standards. |
Automotive | Designed for automotive applications, automotive-classified parts help designers meet Automotive Electronics Council (AEC)-Q100 or AEC-Q101 standards, or other automotive specifications. See the product’s data sheet for details. |
Enhanced products | TI classifies enhanced products (EP) for use in aerospace and defense applications. Our enhanced product (-EP) plastic portfolio provides ruggedized commercial-off-the-shelf products qualified to meet the Aerospace Qualified Electronic Component (AQEC) standard. To learn more, see the “Enhanced Product Selection Guide” and “QML Flow, Its Importance, and Obtaining Lot Information.” |
Military | TI military-classified parts are suitable for defense and certain aerospace electronics. This classification entails developing parts with uniform methods, controls and procedures and testing microelectronic devices for use within electronic systems, including basic environmental tests to determine resistance to the deleterious effects of natural elements and conditions surrounding military operations. Please see the data sheet for details if the products meet Military Performance Specification MIL-PRF-38535 (qualified manufacturers list [QML] Class Q and Class N). |
Space | TI provides space or space-grade parts qualified for use in space electronics applications. Our portfolio includes QML Class V or similar, radiation-hardness-assured integrated circuits (ICs) or radiation-tolerant ICs, demonstrating the company’s long-standing commitment to the space electronics market. To learn more, see the “Radiation Handbook for Electronics” and “Reduce the Risk in Low-Earth Orbit Missions with Space Enhanced Plastic Products.” |
High temperature | TI high-temperature parts can withstand extreme temperatures in electronics systems. High-temperature products are available in ceramic (210°C), high-temperature plastic (175°C) and known good die. |
Part classifications
Rating | Catalog | Automotive |
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Enhanced product (EP)Military | Space | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Classification | Commercial | AEC-Q100 |
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Enhanced product (EP)QML-Q | Space EP | SHP | QML-P | QML-Y | QML-V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Production testing and documentation provided | Vendor item drawing (VID) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Standard microcircuit drawing (SMD) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Process conformance report | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Process conformance report content | MIL-PRF-38535 Group A, B, C, D | See product page | MIL-PRF-38535 Group A, B, C, D, E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturing | Single controlled baseline | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Multiple wafer lots per reel possible | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Life test per wafer lot | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Packaging | Package construction | Plastic | Plastic | Plastic | Hermetic | Plastic | Plastic | Plastic-wirebond or flip chip with overmold | Plastic-flip chip without overmold | Hermetic | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Bond wire | Au/Cu | Au/Cu | Au | Al | Au | Au | Au | N/A | Al | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Pure tin (Sn) lead finish possible? | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
>97% tin (Sn) inside package possible | Flip chip | Flip chip | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Production burn-in required | Burn-in unless optimization aligned with DLA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Outgassing tested per ASTM E595 | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Radiation | TID characterization range (krad/Si) | 30 to 50 | 50 to 300 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TID radiation lot acceptance testing (RLAT) range - RHA (krad/Si) | 20, 30 or 50 | 50, 100 or 300 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SEL immunity (MeV*cm2/mg) | ≥43 | ≥60 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Typical temperature range | -40 to +85°C | -40 to +125°C | -55 to +125°C | -55 to +125°C | -55 to +125°C | -55 to +125°C | -55 to +125°C | -55 to +125°C | -55 to +125°C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Table illustrates typical values for each classification rating. For precise data or detailed information, please refer to the product-specific page. Definitions: SMD=Standard microcircuit drawing |
Understanding part-level ratings vs. product-level ratings
TI offers ratings of its parts, also known as orderable part numbers. On TI.com, we group a number of parts in a product page. In the event that a single product page has parts with more than one rating, TI will show all appropriate ratings and make the appropriate part-level rating clear where appropriate.